Summary

Fico Molding Line and Fico AMS-LM/MMS-LM/i systems are advanced assembly processes and equipment developed by Besi for leadframe, substrate, and wafer-level packaging applications across diverse industries like electronics, mobile, cloud, automotive, industrial, LED, and solar energy. These systems cater to Semiconductor Industries N.V.’s broad client base.

Title

Homepage | Besi

Description

Homepage | Besi

Keywords

more, information, line, plating, quantum, foil, events, read, bonding, plus, publications, investor, archive, semiconductor, company, sustainability, technology

NS Lookup

A 185.71.62.126

Dates

Created 2026-02-15

Updated 2026-02-15

Summarized 2026-03-18